Micro-nano three-coordinate measuring machine
With the rapid development of MEMS technology and the semiconductor industry, microfabrication technology has given rise to a series of key devices. The characteristic dimensions of these devices range from hundreds of micrometers to millimeters, featuring a high aspect ratio and geometric accuracy requirements as high as tens of nanometers. To ensure the processing accuracy and quality of these micro-devices, three-dimensional ultra-precision measuring instruments need to be adopted.
In non-contact optical measurement equipment, white light interferometers are restricted by the diffraction limit, making it difficult for them to break through the resolution of 100 nanometers in lateral measurements, and they cannot penetrate deep holes to achieve inner wall scanning. Although confocal microscopy has sub-micron depth resolution, it is ineffective for blind hole measurement with a depth-to-diameter ratio greater than 5:1. Although scanning Probe technologies such as AFM can achieve atomic-level resolution, the cantilever range of their probes is usually less than 100 µm, which cannot cover millimeter-level deep hole structures. Moreover, due to the vulnerability of brittle materials, it is difficult to meet the measurement requirements of industrial fields. This measurement capability gap severely restricts the industrialization process of high-precision microdevices, and there is an urgent need to develop new cross-scale measurement equipment. The traditional Coordinate Measuring Machine (CMM) is limited by the ruby ball at the tip of the probe available on the market, which has a minimum diameter of 300 µm and is unable to measure internal dimensions smaller than 300 µm. Therefore, it is necessary to develop micro-nano CMMS with higher precision and equip them with micro-probes whose measuring ball diameters are smaller than the lateral dimensions to be measured.
UPM series Ultra-high precision CMM produced by DIPSEC, has the following characteristics, to ensure its high precision and working stability
1) Fixed with gantry structure, gantry framework using industry recognized as the best quality green granite, jinan jinan green has excellent thermal stability, material bibulous rate is low, the thermal expansion coefficient is small, low thermal conductivity of a bit, The gantry frame manufactured by Jinan Qing Materials features low strain and high stability. The guide rails made through a special grinding process have a high surface finish, high precision, and stable and reliable precision maintenance.
2) Ceramic guide rail technology. Silicon carbide is a new type of high-performance structural material with extremely high hardness, reaching a Mohs hardness of 9.0, second only to diamond. Due to its high hardness, silicon carbide guide rails can effectively reduce wear and extend the service life of equipment. In addition, silicon carbide features extremely high thermal stability and a very low coefficient of thermal expansion, and it has excellent physical properties. Its outstanding rigidity is seven times that of steel, which enables it to maintain good stability under high load and high-speed operation conditions and is less prone to deformation. The guide rails made of silicon carbide have a surface finish of up to 0.2μm and excellent thermodynamic performance, which can resist the strain caused by temperature changes and ensure the stability of the guide rail accuracy.
3) The silent low-resistance wiring harness system, like the gravity balance system, is also designed to reduce the reaction force during axial movement, enhance high response under dynamic conditions, and minimize hysteresis to ensure more accurate measurements.
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